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第三届材料科学与智能制造国际学术会议

2025 3rd International Conference on Materials Science and Intelligent Manufacturing

MSIM
发布时间:2024-09-02 15:37:01 人浏览过
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  • 会议简介

    第三届材料科学与智能制造国际学术会议(MSIM 2025)将于2025年1月10日至12日在中国广东广州召开。MSIM将围绕“电子陶瓷与器件”、“敏感材料与器件”、“电介质材料”、“复合材料”、“粉体工艺与烧结技术”、“智能制造”等最新研究领域,为学者、工程师和行业专家提供了一个交流新想法和研究成果的有利平台。

    本次会议也将助力参会者建立业务或研究上的联系以及寻找未来事业上的全球合作伙伴。我们希望这次会议能够对这些最新科学领域的知识更新做出重大贡献。诚挚欢迎海内外学者投稿和参会。

    支持单位

    江西理工大学信息工程学院

    Robotic and Research Automation Lab

    会议组委

    大会主席

    Meharan Emadi Andani 教授

    意大利维罗纳大学

    (IEEE 高级会员)

    出版主席

    Ata Jahangir Moshayedi 副教授

    江西理工大学

    (IEEE高级会员)

    技术程序委员会主席

    Zeashan Khan 教授

    法赫德国王石油与矿业大学

    (IEEE高级会员)

    征稿主题

    材料科学

    1.电子和磁性材料

    2.计算材料科学

    3.多个铁序参数的耦合

    4.晶体缺陷工程

    5.晶体学领域工程

    6.畴微结构演化

    7.畴尺寸效应,晶粒尺寸效应,小颗粒,薄膜

    8.纳米材料和纳米技术

    9.铁和铁间相变

    10.基础和特性

    11.超磁致伸缩材料和磁性形状记忆合金

    12.相变和畴变的动力学途径

    13.磁性材料

    14.材料化学

    15.多铁性材料和复合材料

    16.纳米技术和材料

    17.形状记忆合金和马氏体

    智能制造

    1. 生产过程模拟

    2. 建模和设计

    3. 智能系统

    4. 智能机电一体化

    5. 微加工技术

    6. 先进制造技术

    7. 可持续生产

    8. 回收和再制造

    9. 快速制造

    10. 数字化制造(CAx、CAPP、MES、DES等)

    11. 微电子封装技术与设备

    12. 集成制造系统

    13. 工程优化

    14. 系统分析和工业工程

    15. 制造过程的建模、分析和仿真

    16. 制造过程的测试、测量、监视和控制

    投稿须知:

    1、论文是英文稿件,且论文应具有学术或实用价值,未在国内外学术期刊或会议发表过。发表论文的作者需提交全文进行同行评审,只做报告不发表论文的作者只需提交摘要。

    2、作者可通过CrossCheck, iThenticate查重或其他查重体统自费查重,否则由文章重复率引起的被拒搞将由作者自行承担责任。涉嫌抄袭的论文将不被出版,且公布在会议主页。

    **注:被录用且完成注册的论文,如需申请撤稿,将扣除30%的手续费。

    - About MSIM 2025 -

    2025 3rd International Conference on Materials Science and Intelligent Manufacturing

    2025 3rd International Conference on Materials Science and Intelligent Manufacturing(MSIM 2025) will be held in Guangzhou China from January 10 to 12 2025. MSIM is an annual conference providing a yearly platform for delegates and members to present and discuss the latest research and our delegates and members will have many opportunities engage in dialogues about Materials Science and Intelligent Manufacturing. It also provides new insights and bring together scholars scientists engineers and students from universities and industry all over the world under one roof. We warmly invite you to participate in MSIM 2025 and look forward to seeing you in MSIM!

    Important Dates

    Full Paper Submission Date

    December 10 2024

    Registration Deadline

    December 1 2024

    Final Paper Submission Date

    December 12 2024

    Conference Dates

    January 10-12 2025

    Committee of MSIM 2025

    Conference General Chair

    Prof. Dr. Meharan Emadi Andani

    University of Verona Verona Italy

    (IEEE Senior Member)

    Publication Chair

    Assoc. Prof. Ata Jahangir Moshayedi

    Jiangxi University of Science and Technology

    (IEEE Senior Member)

    Technical Program Committee Chair

    Prof. Dr. Zeashan Khan

    Interdisciplinary Research Center for Intelligent Manufacturing & Robotics KFUPM Saudi Arabia

    (IEEE Senior Member)

    Technical Program Committees

    Prof. Vikas Gupta Technocrats Institute of Technology Bhopal M.P. India

    Prof. Tirumala Ramashri SVUniversity College of Engineering India

    Prof. Chandra Singh Department of ECE India

    Prof. Miadreza Shafie-khah University of Vaasa Finland

    Prof. PRIOU University Paris Nanterre France

    Prof. Ian R. McAndrew Dean of doctoral programs at Capitol Technology University USA

    Prof. Badrul Hisham bin Ahmad Universiti Teknikal Malaysia Melaka Malaysia

    Prof. Yipin Wan Chang‘an University China

    Prof. Junxi Bi College of Aviation Inner Mongolia University of Technology China

    Prof. Ning Sun Nankai University China

    Prof. Nianbing ZhongChongqing University of Technology China

    Prof. Liangliang Tian Chongqing University of Arts and Sciences China

    Prof. Bin Cao Hebei University of Technology China

    Prof. Shaolin Liao Sun Yat-sen University China

    Prof. Ning Sun Nankai University China

    Assoc. Prof. Mingwei Qin Southwest University of Science and Technology China

    Assoc. Prof. Mingwei Qin Southwest University of Science and Technology China

    Assoc. Prof. Chuanjun Zhao Shanxi University of Finance and Economics China

    Dr. Tian Su School of Civil Engineering and Geomatics China

    Call For Papers

    The topics of interest for submission include but are not limited to:

    Materials Science and Engineering

    1. Electronic and magnetic materials

    2. Computational materials Science

    3. Coupling of multiple iron sequence parameters

    4. Crystal defect engineering

    5. Crystallography engineering

    6. Domain microstructure evolution

    7. Domain size effect grain size effect small particles thin films

    8. Nanomaterials and nanotechnology

    9. Phase transition between iron and iron

    10. Fundamentals and characteristics

    11. Giant magnetostrictive materials and magnetic shape memory alloys

    12. Kinetic pathways of phase transition and domain change

    13. Magnetic materials

    14. Materials chemistry

    15. Multiferroic materials and composites

    16. Nanotechnology and materials

    17. Shape memory alloys and martensite

    Intelligent Manufacturing

    1. Production process simulation

    2. Modeling and design

    3. Intelligent system

    4. Intelligent mechatronics

    5. Micromachining technology

    6. Advanced manufacturing technology

    7. Sustainable production

    8. Recycling and remanufacturing

    9. Fast manufacturing

    10. Digital manufacturing (CAx CAPP MES DES etc.)

    11. Microelectronics packaging technology and equipment

    12. Integrated manufacturing system

    13. Engineering optimization

    14. Systems analysis and industrial engineering

    15. Modeling analysis and simulation of manufacturing processes

    16. Testing measurement monitoring and control of manufacturing processes

    Publication

    All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process all accepted papers will be published in the Conference Proceedings and submitted to EI Compendex Scopus for indexing.

    Note: All submitted articles should report original results experimental or theoretical not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

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